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Job Title: R&D - BSP Software Development Engineer
Job Area: Engineering -Software
Location: Shenzhen/Shanghai/Beijing
Job Function:
Develop and maintain board support package(BSP) software for smart phones.
Primary responsibilities including:
Low level driver design and enabling on smart phones.
Device bring-up and low level software integration
Support Qualcomm 3G CDMA/WCDMA chipset customer for design-win projects
Skills/Experience:
Strong software design and debug skills with real-time/embedded systems
Master in ASM/C language
Expertise in driver development on RTOS,Linux/Android platforms
Familiar with ARM architecture, ARM assembly and ARM-based SOC components
Rich experience in troubleshooting and debugging - familiar with Trace32 tool
Familiar with QC chipset platform is a plus
3+ year work experience in embedded software development
Strong English communication and interpersonal skills
Ability to learn quickly, and must be a self-starter with high motivation
CE support of QRD partners and customers
Support development in phone turnkey designs
Education Requirements:
Bachelor's or Master's Degree in Computer Engineering, Computer Science, Electrical Engineering
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